LIGO Document T1300040-v1
- A short note to capture concepts and methods for achieving reliable and relatively clean solder joints for ultra-high vacuum applications. This process is likely to evolve over time, but is initially targeted at soldering items that are not practical to be re-cleaned via the standard LIGO clean and bake process. An example of when this soldering procedure might be used would be a spot repair of a wire or solder joint for an item that is part of a complex system rendering it impractical to disassemble.
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